Thermal release materials are a unique and benefits-packed approach to your holding, transfer, carrier masking and protection applications. Suited for use in the widest range of electronic industry applications. Used to hold PCB’s during cutting or to prevent movement of parts, can transfer once-bonded parts to a variety of substrates; LED etching, with piezoelectric devices in an electrode print process, or for the transfer of chips. It can be used as a FPC or chip carrier, making it ideal for continuous and/or automated operations.
