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TCP thermally conductive pads
Thermally conductive pads can offer a unique combination of extremely high thermal conductivity and softness. The combined features reduce mechanical stress while maintaining thermal performance. Several offerings are free of silicone, an ideal situation for some applications, Some feature no oil bleed. An example is a gap filler pad transferring heat in a densely packed PCB.

Thermal Pad Working Mechanism


Production Line

Test Method and Equipment


Technology Superiority

High thermal conductivity

 Specialized silicone chemistry provides good electrical insulation

 Precise coating and hot-press molding technology

 Good thermal stability whatever ultra-thin or ultra-thick material

 Rapid and efficient service for making sample and die-cutting

 Instant customization in color, thickness, hardness or thermal conductivity

 Can be laminated with adhesive upon request

 Can be one-sided tacky upon request


Product Superiority

 Instant customization for thickness ( 0.1mm ~~ 15.0 mm) and color

 Special fillers to achieve specific thermal conductivity: 1.5 W/(m.K) ~~ 17 W/(m.K)

 Good electrically insulation, withstand voltage exceed 10(KV/mm), up to 17(KV/mm)

 Offer excellent conformability to cover uneven and rough surfaces

 Easy to fit diversified gap conditions. Avoid hard contact and protect IC chips

 Elastomeric property to provide mechanism balance

 Adhesive or natural self-tacky to stick on heat sink


Product Structure

 Base material: Silicone

 Filler: Boron nitride, Diamond, Aluminum nitride, Aluminum oxide, etc.

 Flame resistance: Metal hydroxide

 Additive: Colorant, Catalyst

 Application Design



Coding Principle


Typical Properties


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